Transducer interconnect with conductive films

ABSTRACT

An electronic device has an electronic signal source electrically connected to a signal routing circuit, an electrically activated transducer to receive electronic signals through the signal routing circuit, and an anisotropic conductive film to provide electrical continuity between the signal routing circuit and the transducer, the anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer. A print head has a jet stack including an aperture plate having apertures arranged to allow passage of ink stored in the jet stack, a diaphragm arranged adjacent the jet stack so as to apply pressure on the ink stored in the jet stack, a transducer arranged to cause the diaphragm to deflect when activated, an anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer, and an electrical interconnect formed from the anisotropic conductive film arranged to electrically couple the transducer to a signal routing circuit. A method includes patterning an anisotropic conductive film to form an array of openings or recesses, bonding the patterned anisotropic conductive film to a transducer side of a transducer array such that openings or recesses in the anisotropic conducting film are arranged adjacent each transducer so as to not contact the transducer in the region of maximum deflection, and bonding a signal carrying circuit array to a circuit side of the transducer array using the patterned anisotropic conductive film.

BACKGROUND

Some electronic devices use transducers to convert electrical signalsinto motion or to exert a force. These transducers may beelectromechanical, microelectromechanical systems (MEMS), acoustic,piezoelectric, etc. One example of this type of device is a print head,in which a transducer is activated by an electronic signal to cause inkto exit the print head through a jet or nozzle. In some examples, whenthe system activates the transducer with an electrical signal thetransducer actuates and displaces a diaphragm or other structure that inturn causes the ink to pass through the jet onto a printing substrate.

In devices that utilize these types of transducers, such as ink jetprint heads, a non-conductive adhesive standoff typically exists to holdelectrical contact pads on a flexible circuit or rigid circuit board inproximity to the transducer elements. Because the adhesive standoff isnon-conductive, it must posses a hole or other gap over the actuator toallow electrical interconnect to the transducer. The interconnecttypically consists of a conductive adhesive placed in the opening in thestandoff, in contact with the pads on the circuit element and in contactwith the actuator elements, providing electrical continuity betweenthem. A typical example of the conductive adhesive would be asilver-loaded epoxy.

The conductive epoxy is rigid in the cured state and may provide anundesirable mechanical coupling to the circuit element and betweentransducers. Mechanical coupling of the transducer to the circuitelement results in mechanical loading of the actuator and reduced motionfor a fixed voltage driving it. In many cases increasing the voltage tothe actuator will compensate for the mechanical loading, but isundesirable. A second result of the mechanical coupling between thecircuit element and the actuators is ‘cross talk’ or accidentalalteration of the behavior of neighboring transducers to an activatedtransducer.

Other, softer, conductive adhesives seem to eliminate the mechanicalcross talk, but have reduced reliability in thermal cycling. Thermalcycling figures significantly in design considerations in solid ink jetprinters, as heat is applied throughout the system to keep the ink inits liquid/molten state and heat is removed when the system is turnedoff.

The loading of the transducer by the conductive adhesive and the circuitelement typically has some variability across an array. This leads todiffering deflections within the array, resulting in different dropmasses of the ink drops and different speeds. This variability, ifuncorrected, has negative impact on image quality

Anisotropic conducting films (ACF) are widely used in flat panel displaytechnology as the interconnect between a circuit element and displayelements. These films typically have low or no conductivity in the X-Yplane that typically has large dimensions compared to the thickness buthave high conductivity along the third axis, often labeled the Z-axis.As a result, these are also sometimes referred to as Z-axis conductingfilms. The base film may consist of a thermoset plastic, athermoplastic, a thermoplastic adhesive or a thermoset adhesive. Thefilm provides a matrix for electrically conducting elements that aredispersed in the film that span the z-axis and provide the electricalconduction through the film. The anisotropy of the conductivity is theresult of having the conducting elements in low enough concentrationthat they only infrequently touch to provide limited lateralconductivity. The conducting elements are typically small metal balls,metal coated polymer balls, or oriented thin metal rods. Theseinterconnects are normally used with stationary electrical elements andare therefore not normally concerned with the mechanical loading of atransducer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 show embodiments of a current implementation of a printhead using an non-conducting standoff and conductive adhesive.

FIG. 3 shows a side view of an embodiment of a portion of a print headusing an anisotropic conductive film patterned to eliminate mechanicalloading.

FIG. 4 shows a side view of an embodiment of a portion of a print headusing a patterned anisotropic conducting film during mechanicalactuation.

FIG. 5 shows an embodiment of a patterned interconnect cut from ananisotropic conducting film.

DETAILED DESCRIPTION OF THE EMBODIMENTS

For ease of understanding of the embodiments described here, thediscussion will focus on a print head as an example of an electronicdevice using a conductive interconnect in conjunction with transducers.However, these just serve as examples and are not intended to, norshould they be interpreted as, any limitation on the scope of theclaims. The embodiments described here may apply to any fluid dispenserthat dispenses fluids through an array of nozzles or jets. Similarly,the term ‘printer’ does not limit itself to devices that just dispenseink, solid ink or otherwise. Other materials may be dispensed by devicesthat have many similarities to ink printers, but may actually dispenseother materials, such as biological fluids, pharmaceuticals, etc.

FIG. 1 shows a portion of an ink jet stack in a cross-sectional sideview. The ink jet stack 10 may consist of a number of plates that aremounted to one another. For example, the ink jet stack 10 may include anozzle plate 14, an inlet plate 18, a body plate 22, and a diaphragmplate 26. These plates are assembled and bonded to one another usingbrazing or adhesives in a known manner to form ink jet stack 10.Additionally, the stack may include filters, heating layers or otherlayers. Alternatively, subassemblies may make up the ink jet stack, withthe subassemblies molded or formed by other processes such aslithography or etching.

The resulting ink jet stack may have a structure similar to the oneshown in FIG. 1. Regardless of the fabrication method, ink chambers 34receive ink from an ink source through inlets 38. In response to theinput of electrical energy provided through conductive adhesive 46 andan electrical contact pad 50, actuator 42 moves causing the diaphragm26, mounted to the actuator, to deflect. The diaphragm plate 26 is madeof a resilient, flexible material, such as thin stainless steel,enabling the plate to move back and forth to expel ink in one directionof movement and to draw ink into the ink chamber 34 in the otherdirection of movement. The ink expelled from the ink chamber 34 exitsthrough one of the openings 30 in the nozzle plate 14.

The electrical contact pad 50 mounts to a support member 54, such as aflex cable or a multi-layer circuit board. Standoff 58 holds the supportmember 54 also in proximity to the actuator 42. The actuator may includepiezoelectric material sandwiched between two electrode structures,which may be made of nickel, for example. The conductive adhesive 46 isin contact with the contact pad 50 and the electrode on the actuator 42to provide electrical continuity between the signal source and theactuator.

A printhead controller, or electronic signal source, generates anelectrical signal; the signal is in turn conducted by an electrical leador signal routing circuit formed as part of the electrical contact pad50 to the conductive adhesive and the electrode contacting the adhesive.In response to the signal from the signal source, the PZT and diaphragmdeflect as shown in FIG. 2.

In FIG. 2, the actuator material 42 a and the portion of the diaphragm26 a immediately adjacent to the actuator material have moved inresponse to a signal to induce ink to be pulled into the ink chamber 34a, while the actuator material 42 b and the portion of the diaphragm 26b immediately adjacent that actuator material move to expel ink from theink chamber 34 b in response to a different signal. The amount ofdeflection shown in FIG. 2 is exaggerated for illustration purposes andis typically about one micrometer or less. The printhead controllerselectively generating an electrical signal causes an ink jet stack toeject ink in an on-demand manner.

As seen in FIG. 2, the deflection of the actuator material produces aforce that primarily acts upon the diaphragm to expel ink from or pullink into the ink chambers 34. This force also operates on the conductiveadhesive 46, the electrical contact 50, and the support member 54. Thisoperation results in a mechanical load and a parasitic force on theelectrical connections that decreases the deflection of the actuator.The decreased deflection reduces the force available for manipulation ofthe ink. Since the deflection amplitude of the actuator is much greaterin the center than at the edges of the actuator, the effect of themechanical load in the central region of the actuator is much greaterthan at the edges of the actuator.

Current print heads compensate by increasing the voltage for the drivingsignal, the size of the actuator, or other alterations of the stackstructure. The size of the conductive adhesive such as silver epoxy, thedistance between the actuator material 42 and the contact pad 50, andthe location of the conductive adhesive with respect to each actuatorand pad, are all factors that can vary across the array of ink jets in aprinthead. These variations cause the mechanical loads on the actuatorsto vary within the array. To compensate for the different loads withinthe array of actuators, the voltage needs to be changed for eachactuator so that similarly sized ink drops are formed from each elementof the array. A process referred to as ‘normalization’ determines thevoltages that cause the jets to dispense similarly sized ink drops. Theprint head controller stores these voltages in a memory for retrievaland use to operate the ink jets in a printhead.

The normalization process creates structure and processing poweroverhead for the printer, increasing the printer cost. Reduction of thatoverhead allows for lower production costs. Reducing the mechanical loadto the actuator and making the load more uniform results in a print headthat does not require as much normalization.

It is possible to use a uniform ACF instead of the combination of theinsulating standoff and silver epoxy conductor for eachtransducer-contact pad pair. However, this configuration still has themechanical loading of the transducer and the possibility for variabilityacross the array.

Using an ACF and introducing openings centered on the transducers makesit possible to nearly completely eliminate the mechanical loading of theactuator and attendant voltage increase, variability, and cross-talk.The ACF replaces the standoff and conductive adhesive interconnect, andgenerally the term ‘standoff’ refers to separation of two electricalelements with an insulator. The ACF may be referred to as aninterconnect, mechanically decoupled interconnect, mechanicallydecoupled ACF interconnect, or a one-dimensional conductive film.

FIG. 3 shows a side view of a print head having an interconnect with anopening over the central portion of the actuator so as to avoid strongmechanical coupling where the actuator has the greatest motion. In thisembodiment, the insulative standoff 58 and the conductive adhesive 46 ofFIG. 1 have been replaced with an ACF interconnect 70. Using the ACFinterconnect to make the electrical connections necessary allows for ahole, opening or gap 64 to exist in the ACF interconnect, allowing thetransducer to move freely. This reduces the mechanical load andresistance to motion.

FIG. 3 shows that an ACF interconnect such as 70 can make the electricalconnection necessary to activate the transducer. A metal lead 60 mayreside inside the inner layers of the multi-layer circuit board or flexcircuit that may comprise the support member. The lead 60 makesconnection to the contact pad 50 through the metalized via 62. Using theinterconnect 70 allows the electrical path to connect through it to thetransducer 42. The larger surface area made available by the use of anACF interconnect permits good electrical contact at or near the edges ofthe transducer and allows the selective removal of material adjacent thecentral portion of the transducer to reduce the mechanical loading bythe electrical interconnect. In the case where the polymer matrix is athermoplastic adhesive, it is sometimes possible to remove theelectrical element on one side of the interconnect by heating thethermoplastic. This ability to remove and replace an electrical elementcan be convenient to repair or reuse parts of the assembly.

One example of an interconnect is an anisotropic conductive film (ACF)having metal nanowires that span the z-axis embedded within it, or metalparticles dispersed in a polymer matrix. For purposes of thisdiscussion, a nanowire is a wire that has a diameter in the nanometerrange (10⁻⁹ m).

FIG. 4 shows an example of transducers 42 a and 42 b activated byelectrical signals. As in FIG. 2, the transducer 42 a has been activatedto pull ink into the ink chamber 34 a through inlet 38 a and transducer42 b has been activated to push ink out of the nozzle 30 b. As shown inFIG. 4, the gaps or openings 64 a and 64 b alleviate any mechanicalloading resulting in reduced the motion of the transducers. Thisincreases the consistency of the print head, for each nozzle over time,and across the print head from nozzle to nozzle.

Without mechanical loading, or with nominal mechanical loading, thetransducer 42 a may achieve the required deflection at a lower voltagethan if there were a mechanical load present. Eliminating the mechanicalloading and resulting coupling between adjacent actuators will alsoreduce cross-talk and lead to more uniform performance across the array.In addition, by reducing the number of components in the print head, themanufacturing process may be simplified.

The ACF can be pre-formed by die cutting or laser cutting of acontinuous ACF film. Holes arranged adjacent to each element of thetransducer remain small enough to contact the edges of the actuator. Thekey limitation to the size of the opening is that enough material has toremain to allow electrical connection. In a specific example, thepatterned ACF film is tacked to the actuator array with heat andpressure. Finally a circuit board is aligned on top of the patterned ACFand the material bonded at 160 degrees Celsius and a pressure of 30 PSIfor 10 seconds. The exact process parameters for assembling theelectrical circuit elements with the ACF will depend on the specificcharacteristics of the film.

Using a nanowire ACF as the interconnect provides several advantages.Generally, this material is available in large sheets. It can be die orlaser cut, depending upon the features and their accuracy requirements.FIG. 5 shows an example of an electrically conductive adhesiveinterconnect for a print head application.

The interconnect 70 has a pattern of holes such as 74 to allow bettermovement of the PZT elements in an array of PZTs. This pattern hassomewhat high precision requirements that are easily obtained by eitherdie or laser cutting. The interconnect 70 can also have pattern of holessuch as 72 as ink port holes to allow the ink flow into the ink chamber.

In some electronic devices, the interconnect undergoes laser cutting, sothis material easily works into existing manufacturing processes. Inaddition, one available nanowire ACF consists of a thermoplasticpolyimide that bonds at 160 degrees Celsius in less than three seconds,and is available in sheet form, allowing easy shaping and laser cutting.The ACF may be bonded first to the transducer array on one of its sides,referred to here as the transducer side, and then to the signal routingor carrying circuit on its other side, referred to here as its circuitside. Alternatively, the signal circuit may be bonded to the ACF firstand then the ACF bonded to the transducer array, or they could be bondedsimultaneously.

In addition to reducing the number of process steps, an ACF interconnectprovides both thermal and electrical conductivity and increased thermalconductance that allows for more thermally efficient transfer of heatfrom the electrical side to the jet stack from a heater that resides onthe back. In some examples, the adhesive bonds faster, reducingprocessing time. The ability to easily remove material without alignmentconstraints increases transducer efficiency without burdening themanufacturing process. Reliability increases due to the elimination ofconductive epoxy cracking. Using the nanowire ACF also provides thepotential to migrate to higher transducer densities if needed.

It will be appreciated that several of the above-disclosed and otherfeatures and functions, or alternatives thereof, may be desirablycombined into many other different systems or applications. Also thatvarious presently unforeseen or unanticipated alternatives,modifications, variations, or improvements therein may be subsequentlymade by those skilled in the art which are also intended to beencompassed by the following claims.

1. An electronic device, comprising: an electronic signal sourceelectrically connected to a signal routing circuit; an electricallyactivated transducer to receive electronic signals through the signalrouting circuit; and an anisotropic conductive film to provideelectrical continuity between the signal routing circuit and thetransducer, the anisotropic conductive film having material removedadjacent the transducer to reduce mechanical loading of the transducer.2. The device of claim 1, wherein the electrically activated transducercomprises one of a piezoelectric transducer, a microelectromechanicalsystem transducer, or an audio transducer.
 3. The device of claim 1,wherein the conductive film comprises a polymer material havingconductive members dispersed in a polymer matrix.
 4. The device of claim3 wherein the polymer material comprises a thermoset adhesive.
 5. Thedevice of claim 3, wherein the polymer material comprises thermoplasticadhesive
 6. The polymer material of claim 5 that can be reheated toremove or replace circuit elements.
 7. The device of claim 1, whereinthe signal routing circuit comprises a signal trace on one of either aflexible electronic circuit substrate or an electronic circuit board 8.The device of claim 1, the device further comprising: a diaphragmarranged adjacent the transducer; a fluid reservoir arranged adjacentthe diaphragm on a side opposite the transducer; and a jet arrangedadjacent the fluid reservoir on a side opposite the diaphragm, such thatwhen the transducer is activated to cause the diaphragm to deflect,fluid in the reservoir is expelled through the jet.
 9. The device ofclaim 1, wherein an amount of material removed from the anisotropicconducting film adjacent to each transducer depends upon the desiredlevels of electrical continuity and a reduction of mechanical load. 10.A print head, comprising: a jet stack including an aperture plate havingapertures arranged to allow passage of ink stored in the jet stack; adiaphragm arranged adjacent the jet stack so as to apply pressure on theink stored in the jet stack; a transducer arranged to cause thediaphragm to deflect when activated; an anisotropic conductive filmhaving material removed adjacent the transducer to reduce mechanicalloading of the transducer; and an electrical interconnect formed fromthe anisotropic conductive film arranged to electrically couple thetransducer to a signal routing circuit.
 11. The print head of claim 10,wherein the electrical routing circuit comprises a trace on flexibleelectronic circuit substrate.
 12. The print head of claim 10, whereinthe electrical routing circuit comprises a trace on a printed circuitboard.
 13. The print head of claim 10, wherein the transducer is apiezoelectric transducer.
 14. The print head of claim 10, wherein theprint head is part of an ink jet printer.
 15. The print head of claim10, wherein the polymer material in the anisotropic conducting filmcomprises one of a thermoset adhesive or a thermoplastic adhesive.
 16. Amethod, comprising: patterning an anisotropic conductive film to form anarray of openings or recesses; bonding the patterned anisotropicconductive film to a transducer side of a transducer array such thatopenings or recesses in the anisotropic conducting film are arrangedadjacent each transducer so as to not contact the transducer in theregion of maximum deflection; and bonding a signal carrying circuitarray to a circuit side of the transducer array using the patternedanisotropic conductive film.
 17. The method of claim 16, wherein thepolymer material comprises a thermoset polymer and bonding comprisesheating the film, signal carrying circuit and the transducer underpressure to form a bond through curing of the adhesive.
 18. The methodof claim 16 wherein the polymer material comprises a thermoplasticpolymer and bonding comprises heating the film, signal carrying circuit,and the transducer under pressure to form an adhesive attachment withthe softened polymer.
 19. The method of claim 16, wherein patterning theanisotropic conductive film further comprises removing the material byone of either laser or die cutting.
 20. The method of claim 16, furthercomprising reheating the conductive film and removing an attachedcircuit element from the remainder of the assembly.
 21. The method ofclaim 16, wherein the bonding of the patterned anisotropic conductivefilm to the transducer side of the transducer array occurs one of priorto, after, or simultaneously with, the bonding of the signal-carryingcircuit array to the circuit side of the transducer array.